Er-Yb: Glass+Co:spinel
The microchip composite component, especially in the form of Er-Yb: Glass +Co: Spinel passively q-switched microchips have been used for 1.5um lasers in remote sensing, ranging and imaging applications due to their compact size and the incorporation of both the lasing material and q-switch into a monolithic element. The approach minimizes system complexity and system size, and maximizes efficiency. The Glass+Er-Yb: Glass is available in two-segment configurations with the optional inclusion of additional undoped Glass part.
Features
ü Innovative high-temperature bonding process for strong bonds
ü Reduce thermal end-effects
ü Compact size
ü External surface coatings
Er-Yb: Glass + Co: Spinel
Dopant Type, Concentration | Er, 1.0wt.%; Yb, 18wt. % |
Cross Section | 1.5mm×1.7mm |
Er-Yb Length | 3.2mm |
Co:spinel Length | 1.5mm |
End-face Configuration | Flat/Flat |
Side Specifications | cut |
Coating | s1:HR@1535nm+AR@940nm; s2: PR@1535nm |
Glass+Er-Yb: Glass+Co:Spinel
Dopant Type, Concentration | Er, 1.0wt.%; Yb, 18wt. % |
Cross Section | 1.5mm×1.7mm |
Undoped length | 2.5mm |
Er-Yb Length | 3.2mm |
Co:spinel Length | 1.5mm |
End-face Configuration | Flat/Flat |
Side Specifications | cut |
Coating | s1:HR@1535nm+AR@940nm; s2: PR@1535nm |
Datasheet_Composite Cystal Er-Yb Glass_Co Spinel
